Tokyo – March 11, 2021 – Toppan Printing, a global leader in communication, security, packaging, décor materials, and electronics solutions, will acquire 89.1% of the outstanding stock of Brookman Technology, Inc. (Brookman Technology), a venture company originated from Shizuoka University and engaged in the development and sales of CMOS image sensors. Brookman Technology is scheduled to be made a subsidiary of Toppan by the end of March this year.
The increasingly advanced functions of smartphones and game devices and the growth in the use of autonomous robots for the industry are expected to drive the expansion of the market for 3D sensors, which gather peripheral information in three dimensions. As technological development advances, Time-of-Flight (ToF) 3D range image sensors, in particular, are being adopted for a wide range of devices on account of their compact form and low power consumption.
Toppan entered into a capital and business tie-up with Brookman Technology in 2017, and the two companies have subsequently collaborated on research and development in the field of 3D image sensing. By making Brookman Technology a subsidiary, Toppan aims to bolster joint efforts and enable a full-scale entry into the growing 3D image sensing market.
Toppan printing will generate Synergy by bringing together Brookman Technology’s track record in image sensor development and ToF sensor design technology with Toppan’s semiconductor circuit design capabilities. Obstacles to an expansion of 3D sensors include image lag and difficulties associated with outdoor use. Toppan aims to overcome these challenges and develop sensors suitable for practical application by taking advantage of Brookman Technology’s unique ToF sensor design capabilities for high-speed imaging, long-distance measurement, and disturbance tolerance.
Targeting rapid commercialization, the two companies will accelerate current joint research on 3D image sensing for autonomous robots and the game and augmented reality fields. The technology is also vitally important for generating data that maps the real world as part of Toppan’s digital transformation (DX) initiatives. Therefore, it will also be leveraged to drive existing DX operations and create new businesses centered on the use of ToF sensors.
Smart Packaging Solutions Virtual Congress -19 March 2021
The Smart Packaging Solutions for India and South Asia Virtual Congress on 19 March focuses on food and pharma supply chains, brand security, and sustainability. Organized jointly by IPPStar and the AIPIA, the virtual congress’s topics include brand authentication, condition monitoring, and active and intelligent packaging that contributes to the safe delivery of authenticated products leading to safety, security, and customer engagement. Please look at the agenda of the conference here, and for registration, please click here. You can also email Ruchi at firstname.lastname@example.org or Umesh at email@example.com. Call us in Noida at 120-4546988 or 4326053 – Umesh at Xtension 30; Ruchi at Xtension 33; Gaurav at Xtension 23; and Mohit at Xtension 25.