The AIPIA-IPPStar Virtual Congress on 19 March shapes up with both sponsors, participants, and experts lining up from the country, the region, and Europe. Early sponsors include Avery Dennison, Fasiculus and Systech with others in the pipeline. The conference for connected and active packaging will focus on India’s food and pharma sectors and their requirements for developing smart supply chains that extend to recycling.
Managed supply chains can save and authenticate food and beverages by using condition monitoring, nanotechnologies, active packaging materials, and various tracking technologies, including embedded codes, blockchains, RFIDs, and NFC. All required collaboration between the brand owner’s product managers and their packaging designers and developers with active technology solution providers. This tech and creative thinking are what this virtual congress is about.
Anti-counterfeiting and brand authentication
It is an opportunity to stop complaining about counterfeit products flooding the market. It is about finding solutions for brand authentication and product integrity and new ways of customer engagement for better consumer information and participation in the sustainable circularity they are now demanding. The session on Recycling and Circularity – How digital fits in will be addressed by Nico Van de Walle, the product innovation manager of Verstraete, and Ivan Gonzalez, CEO of Recyl3R Solutions.
The Smart Authentication: Deploying a Perfect Phygital Solution session will be addressed by Ranesh Bajaj, managing director of Fasiculus, while Easy integrable smart packaging and labels made with printed electronics will be addressed by Marcin Ratajczak, the CEO of Inuru. R2R processing for intelligent packaging applications – future applications beyond hardware for printed electronics upscaling processes, will be addressed by Wolfgang Mildner CEO of MSWtech and Andrea Glawe, sales director of Kroenert. The session on How NFC-enabled smart packaging enhance online shopping experience will be addressed by Chayasorn Suansomjit, Customer Application Engineer Manager Silicon Craft Technology. Packaging intelligence and Brand Protection will be addressed by Udit Singh, Global Solution Architect, Systech.
Digital printing and connected packaging
The session titled, Cutting the line – how digital printing and connected packaging have created new opportunities for brands will be addressed by Time Hadsel-Mares of Scantrust; while the Print Without Ink Technology session will be addressed by Veronica Savu, Founder Morphotonix. Other smart packaging solution sessions include Smart Packaging in the Supply Chain, Condition Monitoring, Smart Packaging for Food Safety & Security, and Augmented Reality and the next step in Smart Packaging. Speakers and moderators will include Stephane Pique the Industry X Lead Switzerland of Accenture and Eef de Ferrante, the managing director of the Active and Intelligent Packaging Industry Association (AIPIA).
The AIPIA Brand Challenge, whereby one of the Indian brand owners poses a particular authentication, supply chain, or customer engagement challenge with the technology providers coming up with solutions, will also be held. The winners will get an opportunity to briefly present their solution in a session just before the end of the virtual congress. The Smart Packaging Solutions virtual congress for Indian food and pharma is a paid event at Euro 70 per participant. It takes place on 19 March from noon to 630 pm India time. Please click here for the agenda and here for registrations. Interested sponsors can click here or simply call or email Andrew Manly or myself.