Seiko Epson Corporation and Manz Taiwan, a manufacturer of equipment for semiconductor panel-level packaging (PLP), have announced a strategic collaboration to accelerate the adoption of inkjet technology in semiconductor manufacturing.
Through this collaboration, Epson will combine its high-precision inkjet printhead technology with Manz Asia’s expertise in the development of semiconductor-related equipment and software. Together, the two companies aim to realize next-generation semiconductor manufacturing processes based on inkjet technology.
An inkjet laboratory equipped with Epson printheads was established in November 2024 at the Manz Asia R&D Center in Taoyuan City, Taiwan. The laboratory supports customers, including semiconductor equipment manufacturers, by answering questions and consulting regarding inkjet-based manufacturing process innovations and by printing samples and providing evaluation services.
Recently, Epson and Manz Asia agreed to a memorandum of understanding to further strengthen and advance their collaboration. In addition to research and evaluation applications, the two companies agreed to develop equipment capable of supporting production-scale manufacturing with mass production in mind. Through this enhanced partnership, they will begin full-scale global deployment of next-generation manufacturing technologies using inkjet technology.
Epson will support the laboratory’s operation by leveraging its expertise from its own inkjet application laboratories, helping customers in process verification and preparations for volume production.
Process innovation based on inkjet additive manufacturing
Inkjet printing technology enables maskless, high-precision deposition and stacking of functional materials on semiconductor substrates such as silicon wafers and glass panels, making additive manufacturing possible within semiconductor production processes. Inkjet technology offers greater process flexibility, improved material utilization efficiency, and reduced environmental impact than conventional fabrication processes.
The inkjet solutions, jointly developed by Epson and Manz Asia, will address a wide range of applications in semiconductor manufacturing processes, including advanced packaging where high reliability and efficiency are required, thereby contributing to enhanced device performance.
Robert Lin, CEO of Manz Asia, emphasized the strategic importance of the collaboration: “Digital printing is transforming semiconductor manufacturing. Together with Epson, we combine advanced printhead technology with our equipment and process expertise to deliver a precise and scalable inkjet platform that enables semiconductor customers to validate process parameters across diverse applications and move seamlessly from R&D to high-volume manufacturing.”
Shunya Fukuda, chief operating officer of Epson’s IJS Operations Division, says, “Digital additive manufacturing using inkjet technology is expected to become a key technology supporting the evolution of semiconductor packaging. By leveraging Epson’s high-precision droplet control technology and volume production know-how developed in the display and printed electronics fields, we will work together with Manz Asia to build a scalable manufacturing platform that bridges laboratory development and high-volume production. Through this initiative, Epson aims to contribute to the sustainable development of the semiconductor industry.”
This collaboration represents a step toward more flexible and sustainable semiconductor manufacturing. Epson and Manz Asia will continue to support innovation in printed electronics and semiconductor manufacturing processes through inkjet technology.
Manz Asia delivers semiconductor equipment and solutions built on core technologies in wet chemistry, plating, inkjet printing, automation, and software integration. Its expertise covers advanced packaging (High-Density PLP / FOPLP) and IC substrate processing (glass and organic core), supporting customers from R&D to high-volume manufacturing.
