Highcon Euclid IIIC for corrugated wins EDP Award at Fespa

0
151
Highcon Euclid IIIC for corrugated wins EDP Award at Fespa
Highcon Euclid IIIC

Highcon System is presenting the capabilities of the new Highcon Euclid IIIC digital cutting and creasing machine to visitors at FESPA Berlin this week in Hall 5.2 for the first time. The fact that the Highcon Euclid IIIC machine for corrugated board has been awarded the ‘Best digital sheetfed cutting solution’ for quality and innovation in technologies for the digital printing industry by the European Digital Press Association (EDP) adds a bit of enthusiasm to its presentation.

The winners of the EDP Awards at the exhibition were selected on the basis of achievement, quality, and cost by 21 eminent trade magazines with editorial emphasis on digital print processes from all over Europe with coverage of 27 countries.

Commenting on the award, Jens Henrik Osmundsen, vice president – sales, Highcon and mgeneral manager of EMEA & APAC, said, “We are extremely proud to have won this award and to have received the recognition of this influential group of editors. I am also very happy to announce that Schoepe Display in Berlin has entered into an agreement to become the first Highcon Euclid IIIC customer in Germany.“

FESPA allows a new category of visitors to discover the opportunities brought by Highcon’s revolutionary laser die-cutting technology. Eitan Varon, Highcon executive vice president, will speak about the new Euclid IIIC and show samples at the FESPA Corrugated Inspiration Lounge in Hall 5.2 C40 every afternoon from 15:45 – 16:00. Silvano Gauch, president of LxBxH, Switzerland, will interact with the visitors about his day to day work with the Highcon Euclid IIIC for corrugated board and answer questions about the capabilities, benefits, daily workflow of the machine on 16 and 17 May 2018 between 13:30 and 15:00 in the afternoon.

LEAVE A REPLY

Please enter your comment!
Please enter your name here